Now Accepting Applications for 2014
The Providence, RI branch of the Fab Academy is now accepting applications for the class of 2014. Classes meet at AS220 Labs in Providence, RI from January 15, 2014 through May 28, 2014 and additional open lab time is available through June 30th, 2014. For complete program information and how to apply, visit our site at as220.org/fabacademy. If you have any additional questions, contact the Providence Fab Academy Instructor, Shawn Wallace or AS220 Labs Manager, James Rutter.
How to make (almost) anything
The Fab Academy is a Digital Fabrication Program directed by Neil Gershenfeld of MIT’s Center for Bits and Atoms and based on MIT’s rapid prototyping course, MAS 863: How to Make (Almost) Anything. The Fab Academy began as an outreach project from the CBA, and has since spread to Fab Labs around the world. The program provides advanced digital fabrication instruction for students through an unique, hands-on curriculum and access to technological tools and resources.
For the past four years AS220 Labs has collaborated with MIT’s Center for Bits and Atoms in offering the Providence Fab Academy. Our lab in Providence is part of a global Fab Lab / Fab Academy network. The Providence branch of the Fab Academy works with other participating Fab Labs and experts from around the world via a distributed educational model where we pool our knowledge to provide a unique educational experience.
Learn to turn codes into things
At the Fab Academy, you will learn how to envision, prototype and document your ideas through many hours of hands-on experience with digital fabrication tools. We take a variety of code formats and turn them into physical objects.
Students will learn to use the following tools: Epilog Mini Laser Cutter, Roland MDX-20 Milling Machine, the Roland CAMM-1 Servo GX-24 Desktop Vinyl Cutter, several MakerBot 3D printers and a ShopBot CNC router. The topics covered in this course include: digital fabrication principles and practices, computer-controlled cutting, electronics design and production, embedded programming, 3D scanning and printing, mold making, casting and composites.